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  001547-9079 Datasheet PDF File

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    0015477626

Molex Electronics Ltd.
Part No. 0015477626
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 51939-079LF
Description PwrBlade®, Power Connectors, 2P 24S 2P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477628

Molex Electronics Ltd.
Part No. 0015477628
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 66429-079LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    0015477640

Molex Electronics Ltd.
Part No. 0015477640
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68449-079
Description 68449-079-B/S II
Tech specs    

Official Product Page

    0015477644

Molex Electronics Ltd.
Part No. 0015477644
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68449-079HLF
Description 68449-079HLF-B/S II DR
Tech specs    

Official Product Page

    0015477642

Molex Electronics Ltd.
Part No. 0015477642
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477646

Molex Electronics Ltd.
Part No. 0015477646
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

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    0015477650

Molex Electronics Ltd.
Part No. 0015477650
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective

File Size 377.32K  /  4 Page

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    0015477652

Molex Electronics Ltd.
Part No. 0015477652
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477648

Molex Electronics Ltd.
Part No. 0015477648
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477654

Molex Electronics Ltd.
Part No. 0015477654
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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