001118-4981 pdf Datasheet P10 Part Num --- IC-ON-LINE


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001118-4981 Datasheet PDF File

For 001118-4981 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	0749812503 74981-2503
Description	2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Shield End Version, 100 Circuits, Pin Length 4.25mm (.167)
File Size	402.63K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-118HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0432498119 43249-8119
Description	Modular Jack, Right Angle, Low Profile, 8/4, Flangeless MOLEX Connector
File Size	525.58K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-115H
Description	BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	74981-1001 0749811001
Description	2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
File Size	405.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-116HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0749812501 74981-2501
Description	2.00mm (.079") Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module 2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
File Size	405.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-133HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	74981-8504 0749818504
Description	2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Pin End Version, 100 Circuits, Pin Length 5.15mm (.202)
File Size	405.70K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-104HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0749812502 74981-2502
Description	2.00mm (.079") Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module 2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
File Size	400.87K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-107HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, RightAngle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	011184341 0011184341
Description	Conductor Punch
File Size	11.48K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-112HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-18-5071 0011-18-5071 0011185071 1118-5071
Description	Insulation Punch
File Size	14.53K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-132HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0011185330
Description	Insulation Punch
File Size	22.15K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-106HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0011185331 0011-18-5331
Description	Insulation Anvil
File Size	23.89K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68498-121HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs				Official Product Page

For 001118-4981 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

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