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VOM452T FSM3JAA 4LS30D 5745412 100100 3046003 A8434 A29DL32X
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  001118-4616 Datasheet PDF File

For 001118-4616 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    11184343 011184343 0011184343

Molex Electronics Ltd.
Part No. 11184343 011184343 0011184343
Description Insulation Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-118HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011185394

Molex Electronics Ltd.
Part No. 0011185394
Description Combination Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-846-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0011184342

Molex Electronics Ltd.
Part No. 0011184342
Description Combination Anvil

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0011-18-4431 001118-4431 0011184431

Molex Electronics Ltd.
Part No. 0011-18-4431 001118-4431 0011184431
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-146-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    01118-4703 011-18-4703 001118-4703 0011-18-4703 11184703 0011184703

Molex Electronics Ltd.
Part No. 01118-4703 011-18-4703 001118-4703 0011-18-4703 11184703 0011184703
Description Anvil

File Size 11.50K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-846-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    011184341 0011184341

Molex Electronics Ltd.
Part No. 011184341 0011184341
Description Conductor Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4616-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0011184450

Molex Electronics Ltd.
Part No. 0011184450
Description Insulation Punch

File Size 14.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4616-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0011-18-4432 001118-4432 0011184432

Molex Electronics Ltd.
Part No. 0011-18-4432 001118-4432 0011184432
Description Combination Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10132446-16LF
Description Minitek® Pwr 3.0 HCC, Plug Housing, 16 Positions, Black Color, GW Compatible.
Tech specs    

Official Product Page

    0011185438

Molex Electronics Ltd.
Part No. 0011185438
Description Insulation Punch

File Size 14.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4616-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

   
Part No. 2SC4616DTP
Description 2000 mA, 400 V, NPN, Si, SMALL SIGNAL TRANSISTOR

File Size 60.49K  /  5 Page

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Amphenol Communications Solutions

Part No. DWRT200PM14616
Description COOLPOWER MEZZANINE
Tech specs    

Official Product Page

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